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42512sy/41812sy/o2611sy 20110930-s00012/ 60811sy/52511sy no.a1959-1/11 http://onsemi.com semiconductor components industries, llc, 2013 may, 2013 LV47009P overview the LV47009P is the ic for 4-channel btl power amplifier that is developed for car audio system. pch dmos in the upper side of the output stage and nch dmos in the lower side of the output stage are complimentary. high power and high quality sound are realized by that. this ic incorporate various functions (standby switch, muting function, and various protection circuit) necessary for car audio system. also, it ha s a self-diagnosis function. functions ? high output : p o max = 41w (typical) (v cc = 15.2v, f = 1khz, r l = 4 ? , max power) : p o max = 24w (typical) (v cc = 14.4v, f = 1khz, thd = 10%, r l = 4 ? ) : p o max = 17w (typical) (v cc = 14.4v, f = 1khz, thd = 1%, r l = 4 ? ) ? built-in muting function (pin 22) ? built-in standby switch (pin 4) ? built-in self-diagnosis function (pin 25) : signal output in case of output clip detection, shorting to v cc , shorting to ground, and load shorting. ? electric mirror noise decrease ? built-in various protection circuit (shorting to ground, shorting to v cc , load shorting, over voltage and thermal shut down) ? no external anti-oscillation part necessary. note 1 : please do not mistake connection. a wrong connection may produce destruction, deterioration and damage for the ic or equipment. note 2 : the protective circuit function is provided to te mporarily avoid abnormal stat e such as incorrect output connection. but, there is no guarantee that the ic is not destroyed by the accident. the protective function do not operate of the operation gu arantee range. if the outputs are connected incorrectly, ic destruction may occur when used outside of the operation guarantee range. note 3 : external parts, such as the anti-oscillation part, may become necessary depending on the set condition. check their necessity for each set. orderin g numbe r : ena1959d orderin g numbe r : ena1959d monolithic linear ic 4-channel btl power amplifier for car audio systems
LV47009P no.a1959-2/11 specifications absolute maximum ratings at ta = 25 ? c parameter symbol conditions ratings unit supply voltage v cc max1 no signal, t = 1 minute 26 v v cc max2 during operations 18 v output current i o peak per channel 4.5/ch a allowable power dissipation pd max with an infinity heat sink 50 w operating temperature topr -40 to +85 ? c storage temperature tstg -40 to +150 ? c junction temperature tj 150 ? c thermal resistance between the junction and case ? j-c 1 ? c/w recommended operating ranges at ta = 25 ? c parameter symbol conditions ratings unit load resistance r l op 4 ? operating supply voltage range v cc op a range not exceeding pdmax 8 to 16 v electrical characteristics at ta = 25c, v cc = 14.4v, r l = 4 ? , f = 1khz, rg = 600 ? parameter symbol conditions ratings unit min typ max quiescent current i cco r l = ? , rg = 0 ? 200 400 ma standby current ist vst = 0v 10 ? a voltage gain vg v o = 0dbm 25 26 27 db voltage gain difference ? vg -1 +1 db output power p o thd = 10% 19 24 w p o max1 max power 37 w p o max2 v cc = 15.2, max power 41 w output offset voltage vn offset rg = 0 ? -150 +150 mv total harmonic distortion thd p o = 4w 0.03 0.2 % channel separation chsep v o = 0dbm, rg = 10k ? 55 65 db ripple rejection ratio svrr rg = 0 ? , fr = 100hz, v cc r = 0dbm 45 65 db output noise voltage v no rg = 0 ? , b.p.f. = 20hz to 20khz 80 200 ? vrms input resistance ri 40 50 65 k ? mute attenuation matt v o = 20dbm, mute : on 75 90 db standby pin control voltage vstby h amp : on 2.5 v cc v vstby l amp : off 0.0 0.5 v mute pin control voltage vmute h mute : off open - vmute l mute : on 0.0 1.0 v * 0dbm = 0.775vrms stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended oper ating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliabili ty.
LV47009P no.a1959-3/11 package dimensions unit : mm (typ) 3236a block diagram sanyo : hzip25 2.0 29.2 25.6 (22.8) (2.6) (5.0) (12.3) (1.0) 0.52 (r1.7) 0.4 18.6 max (14.4) 4.5 (11.0) 3.5 21.7 14.5 4.2 4.0 (8.5) ( 2.5) 125 2.0 + - + - out 1 + v cc 3/4 v cc 1/2 ta b v cc out 1 - pwr gnd1 r l protective circuit mute circuit stand by switch pwr gnd2 pwr gnd3 pwr gnd4 pre gnd 11 9 7 8 12 1 6 20 + 2 22 13 + ac gnd 16 25 r l r l r l + - + - out 2 + out 2 - mute 5v clip diag 5 3 + - + - out 3 + out 3 - 15 17 19 18 in 4 14 stby 24 protective circuit 4 - ++ - out 4 + out 4 - 21 23 low level mute on +5v st on ripple filter dc 10 + in 3 in 2 in 1 c1 + c2 + c6 c5 + + c3 + c4 c8 c7 r2 r1 c9 pd max -- ta -40 -20 0 20 40 60 80 100 120 140 160 0 10 20 30 40 50 60 70 ambient temperature, ta -- c maximum power dissipation, pd max -- w
LV47009P no.a1959-4/11 external components part name recommended value purpose remarks c1 to c5 0.47 ? f cuts dc voltage the larger the constant value, the lower the cut-off frequency the values of c1 to c5 must be the same c6 22 ? f reduces ripples reduces pop noise the larger the constant value, th e longer the amplifier on/off time c7 2200 ? f ripple filter eliminating power supply ripples c8 0.1 ? f improves oscillation stability reducing high-frequency noise c9 1 ? f reduces pop noise the larger the constant value, the longer the mute on/off time r1 10k ? reduces pop noise the larger the constant value, the longer the mute on/off time r2 4.7k ? pull-up resistor * the components and constant values within the test circuit are used for confirmation of characteristics and are not guarantee s that incorrect or trouble will not occur in application equipment. description of operation 1. standby switch function (pin 4) threshold voltage of the pin 4 is set by about 2vbe. the amplifier is turned on by the applied voltage of 2.5v or more. also, the amplifier is turned off by the applied voltage of 0.5v or less. fig1 standby equivalent circuit 2. muting function (pin 22) the muted state is obtained by setting pin 22 to the ground potential, enabling audio muting. the muting function is turned on by the applied voltage of 1v or less to the resistance of 22pin (mute pin). and the muting function is turn off tjis pin opens. also, the time constant of the muting function is determined by external capacitor and resistor constants. it is concerned with a pop noise in amplifier on/off an d mute on/off. after enough examination, please set it. fig2 mute equivalent circuit 4 stby 10k 30k + mute mute off on 10k 18k 1 f about 50 a about 2.5v 200 22
LV47009P no.a1959-5/11 3. acgnd pin (pin 16) the capacitor of the pin 16 must use the same capacitance value as the input capacitor. also, connect to the same pregnd as the input capacitor. 4. self-diagnostics function (pin 25) this function can detect of the unusual state. (1) shorting to v cc /shorting to ground : the pin 25 becomes the low level. (2) load shorting : the pin 25 is alternated between the low level and the high level according to the output signal. (3) output clip detection : when the output voltage clip, the pin 25 becomes the low level. * note: the output offset abnormality is thought of as the leakage current of the input capacitor. in addition, the pin 25 has become the npn open collector output (active low). the pin 25 must be left open when this function is not used. fig3 self-diagnosis function diagram output voltage pin 25 voltage 0v time time output waveform 25 clip detection diag r2 5v
LV47009P no.a1959-6/11 5. sound quality (low frequencies) by varying the value of input capacitor, low-frequency characteristic can be improved. however, it is concerned the shock noise. please co nfirm in each set when the capacitance value varies. 6. pop noise for pop noise prevention, it is recommended to use the muting function at the same time. ? please turn on the muting function simultaneously with power supply on when the amplifier is turned on. next, turn off the muting function after the output dc potential stabilization. ? when the amplifier is turn off, turn off the power supply after turning on the muting function. 7. oscillation stability pay due attention on the following points because parasitic oscillation may occur due to effects of the capacity load, board layout, etc. board layout ? provide the v cc capacitor of 0.1 ? f in the position nearest to ic. ? pregnd must be independently wired an d connected to the gnd poin t that is as stable as possible, such as the minus pin of the 2200 ? f v cc capacitor. in case of occurrence of parasitic oscillation, any one of following parts may be added as a countermeasure. note that the optimum capacitance must be ch ecked for each set in the mounted state. ? series connection of cr (0.1 ? f and 2.2 ? ) between btl outputs ? series connection of cr(0.1 ? f and 2.2 ? ) between each output pin and gnd.
LV47009P no.a1959-7/11 0 50 100 150 200 250 0 2 4 6 8 10 12 14 616 8 10 12 14 8 10 12 14 16 18 0.01 10 10 0.1 23 57 23 57 23 57 110 23 57 23 57 23 57 23 57 100 1k 10k 100 10 100k 0 10 20 30 40 0.1 1 2 3 5 7 2 3 5 7 2 3 5 7 50 0 5 10 15 20 25 810121416 237 5237 5237 5237 5 100 1k 10k 18 thd -- p o 0.01 2 3 5 7 0.1 2 3 5 7 2 3 5 7 1 0.01 2 3 5 7 0.1 2 3 5 7 2 3 5 7 1 10 0.1 23 7 110 5237 5237 5 1 257 3257 3257 3 10 100 thd -- p o thd -- f 0.01 2 3 5 7 0.1 2 3 5 7 2 3 5 7 1 10 0.1 100 10 100k 618 i cco -- v cc thd -- p o v n -- v cc p o -- v cc p o -- f all channel is similar all channel is similar ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 supply voltage , v cc -- v quiescent current , i cco -- ma supply voltage , v cc -- v output power , p o -- w output power , p o -- w total harmonic distortion , thd -- % output power , p o -- w total harmonic distortion , thd -- % frequency , f -- hz total harmonic distortion , thd -- % frequency , f -- hz output power , p o -- w supply voltage , v cc -- v output midpoint voltage , v n -- v output power , p o -- w total harmonic distortion , thd -- % all channel is similar
LV47009P no.a1959-8/11 -- 3 -- 2 -- 1 0 1 0 50 100 200 10 100 23 57 23 57 23 57 23 57 1k 10k 100 23 57 23 57 23 57 23 57 1k 10k 100 23 57 23 57 23 57 23 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100k 0 80 80 81012141618 10 100k 0 20 40 60 20 40 60 80 0 20 40 60 80 10 100k ch.sep -- f 0 20 40 60 0 20 40 60 80 10 100k ch.sep -- f svrr -- f r 0 20 40 60 80 10 100k 10 100k 10 100k respomse -- f svrr -- v cc v no -- rg ch.sep -- f ch.sep -- f all channel is similar ch1 ch2 ch1 ch4 ch1 ch3 ch2 ch1 ch2 ch4 ch2 ch3 ch3 ch1 ch3 ch4 ch3 ch2 ch4 ch1 ch4 ch3 ch4 ch2 150 frequency , f -- hz response -- db frequency , f -- hz channel separation -- db frequency , f -- hz channel separation -- db frequency , f -- hz channel separation -- db ripple frequency , f r -- hz ripple rejection ratio , svrr -- db frequency , f -- hz channel separation -- db output noise voltage , v no -- v supply voltage , v cc -- v ripple rejection ratio , svrr -- db all channel is similar all channel is similar all channel is similar
LV47009P ps no.a1959-9/11 0 10 20 30 40 50 60 23 57 1 2 3 57 2 3 57 10 0 50 100 150 200 250 0 20 40 60 80 100 0 1.0 2.0 3.0 4.0 1.0 2.0 3.0 4.0 5.0 0 5.0 0.1 100 pd -- p o i cco -- vst mute att -- v mute v cc = 14.4v v cc = 16 v standby control voltage , vst -- v quiescent current , i cco -- ma mute control voltage , v mute -- v mute attenuation , mute att -- db output power , p o -- w power dissipation , pd -- w all channel is similar
LV47009P ps no.a1959-10/11 hzip25 heat sink attachment heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. unless otherwise specified, for power ics with tabs and pow er ics with attached heat sinks, solder must not be applied to the heat sink or tabs. b. heat sink attachment use flat-head screws to attach heat sinks. use also washer to protect the package. use tightening torques in the ranges 39-59ncm(4-6kgcm) . if tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. take care a position of via hole . do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. verify that there are no press burrs or screw-hole burrs on the heat sink. warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for e ither concave or co nvex warping. twisting must be limited to under 0.05 mm. heat sink and semiconductor device are mounted in parallel. take care of electric or compressed air drivers the speed of these torque wrenches should never exceed 700 rpm, and should typically be about 400 rpm. c. silicone grease spread the silicone grease evenly when mounting heat sinks. our company recommends yg-6260 (momen tive performance materials japan llc) d. mount first mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. when attaching a heat sink after mounting a semiconducto r device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. when mounting the semiconductor device to the heat sink using jigs, etc., take care not to allow the device to ride onto the jig or positioning dowel. design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device. f. heat sink screw holes be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. when using nuts, do not make the heat sink hole diameter s larger than the diameter of the head of the screws used. a hole diameter about 15% larger than the diameter of the screw is desirable. when tap screws are used, be sure that the diameter of th e holes in the heat sink are not too small. a diameter about 15% smaller than the diameter of the screw is desirable. g. there is a method to mount the semiconductor device to the heat sink by using a spring band. but this method is not recommended because of possible displ acement due to fluctuation of the spri ng force with time or vibration. binding head machine screw countersunk head mashine screw heat sink gap via hole
LV47009P ps no.a1959-11/11 on semiconductor and the on logo are registered trademarks of semiconductor components industries, llc (scillc). scillc owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. a listing of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent-marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc mak es no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability ar ising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequentia l or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s techn ical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorize d for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other appli cation in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of persona l injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture o fthe part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws a nd is not for resale in any manner.

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